

E-Books →Arbitrary Modeling of TSVs for 3D Integrated Circuits
Published by: book79 on 8-03-2025, 09:02 |
0

Free Download Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah , Yehea Ismail , Alaa El-Rouby
English | PDF (True) | 2015 | 181 Pages | ISBN : 3319076108 | 11.7 MB
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
[/b]
Buy Premium From My Links To Get Resumable Support,Max Speed & Support Me
Help Us Grow – Share, Support
We need your support to keep providing high-quality content and services. Here’s how you can help:
- Share Our Website on Social Media! 📱
Spread the word by sharing our website on your social media profiles. The more people who know about us, the better we can serve you with even more premium content! - Get a Premium Filehost Account from Website! 🚀
Tired of slow download speeds and waiting times? Upgrade to a Premium Filehost Account for faster downloads and priority access. Your purchase helps us maintain the site and continue providing excellent service.
Thank you for your continued support! Together, we can grow and improve the site for everyone. 🌐
Related News
-
{related-news}
Comments (0)
Information
Users of Guests are not allowed to comment this publication.
Search
Updates
Partner
» Byte
» Crawli
» Warezomen
» Warez-DDL
» Raidrush
» KATZCD
» Free Ebooks Library
Your Link Here ?
(Pagerank 4 or above)

