E-Books →Physical Design for Multichip Modules

An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated.
Points of interest include :
Clear overview of MCM technology and its relationship to physical design;
Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects;
Different approaches to multilayer MCM routing collected together and compared for the first time;
Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach;
Quantitative data provided wherever possible for comparison of different approaches;
A comprehensive list of references to recent literature on MCMs provided.